ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,038, issued on Jan. 27, was assigned to Airbus SAS (Blagnac, France) and Airbus Operations SAS (Toulouse, France). "Powerplant for an aircr... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,668, issued on Jan. 27, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Sichuan, China) and BOE Technology Group Co. Ltd. (... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,063, issued on Jan. 27, was assigned to Supernal LLC (Washington). "Systems, methods, and devices for passenger monitoring" was invented by... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,503, issued on Jan. 27, was assigned to Yale University (New Haven, Conn.). "Mutant fibroblast growth factor 21 (FGF21) polypeptides" was i... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. D1,110,016, issued on Jan. 27, was assigned to Bauerfeind AG (Zeulenroda-Triebes, Germany). "Sock" was invented by Sandra Popp (Zeulenroda-Triebes... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,532,944, issued on Jan. 27, was assigned to Skechers U.S.A. Inc. II (Manhattan Beach, Calif.). "Footwear heel counter for easier foot entry or ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. D1,110,437, issued on Jan. 27. "Fabric doll" was invented by Shirley D. Simpson (Forest Park, Ga.). The patent was filed on Oct. 8, 2020, under A... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,846, issued on Jan. 27, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai). "Light-emitting panel and display apparatus ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,037, issued on Jan. 27, was assigned to OMRON HEALTHCARE Co. LTD. (Kyoto, Japan). "Sphygmomanometer, blood pressure measurement method, and... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,762, issued on Jan. 27, was assigned to DISCO Corp. (Tokyo). "Processing method of bonded wafer" was invented by Kazuma Sekiya (Tokyo), Kaz... Read More